Methods of Hts Deposition: Thermal Evaporation
نویسنده
چکیده
Among physical vapor deposition techniques thermal evaporation (TE) is the one with the longest standing tradition. However, during the last 30 years of booming semiconductor industry which involves a great deal of thin film technology, deposition techniques like CVD (chemical vapor deposition) or sputtering which often offer unquestionable advantages have been developed to perfection and TE has largely been replaced in production lines. On the laboratory scale, due to their simplicity, techniques like PLD (pulsed laser deposition) or sputtering were much more promising to realize fast results. Consequently, when the new superconductors emerged only a handful of research groups like Berberich (1988), Terashima (1988), Kwo (1989), Prakash (1990), and Chew (1990) performed deposition trials based on TE. However, as time went by it became clear that the performance of the various deposition methods strongly depends on material issues as well as economic aspects. With progressive commercialization, cost effective volume production and reproducibility became the driving forces and the intrinsic advantages of TE turned the scales. In this sense, the story of high temperature superconductor (HTS) film deposition can serve as an example how this technique, sometimes regarded as old – fashioned, still bears a high potential for innovation and surprising efficiency. In the following chapter we will review the basic features of TE when applied for HTS deposition in detail. The specific advantages and problems will be discussed in view of metal tape coating to estimate whether this technique provides a long term perspective for the fabrication of coated conductors.
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